Samsung unveils new lineup of 5G chipsets: These are the key benefits as per the company – Times of India
Samsung Electronics has unveiled a range of new chipsets that will be embedded into the company’s next generation 5G solutions. The company announced these chips at its virtual event, ‘Samsung Networks: Redefined’.
The new lineup of 5G chipsets are aimed to take Samsung’s next-generation 5G lineup to a new level, boosting performance, increasing power efficiency and reducing the size of the 5G solutions.
Samsung 5G chips lineup availability
The new 3GPP Rel.16 compliant chipsets consist of a third generation mmWave Radio Frequency Integrated Circuit (RFIC) chip, a second generation 5G modem System-on-Chip (SoC), and a Digital Front End (DFE)-RFIC integrated chip. The chips will power its next-generation products for 5G build out, including the next generation 5G Compact Macro, Massive MIMO radios, and baseband units, which will all be commercially available in the year 2022.
Samsung full 5G chips lineup
3rd Generation mmWave RFIC
This new chip follows prior generation RFICs from Samsung. The first-generation introduced in 2017 powered the company’s 5G FWA solutions supporting the world’s first 5G home broadband service in the US.
The new RFIC chip supports both 28GHz and 39GHz spectrum, and will be embedded in Samsung’s next generation 5G Compact Macro. The chip incorporates technology that is said to reduce antenna size by nearly 50%, maximizing the 5G radio’s interior space. Other advantages include improved power consumption, resulting in a more compact-sized, lightweight 5G radio. Also, the output power and coverage of the new RFIC chip has increased, doubling output power of the next generation 5G Compact Macro.
2nd Generation 5G Modem SoC
Samsung’s first 5G modem SoCs were introduced in 2019 and powered the company’s new 5G baseband unit and Compact Macro. The new second-generation chip will enable the company’s forthcoming baseband unit to have twice the capacity, while cutting power consumption in half per cell, in comparison to the previous generation. Moreover, supporting both below-6GHz and mmWave spectrums, it offers beamforming and increased power efficiency for 5G Compact Macro and Massive MIMO radio, while reducing the size for both solutions.
DFE-RFIC Integrated Chip
This new chip combines RFIC and DFE functions for both below-6GHz and mmWave spectrums. By integrating these functions, the chip not only doubles frequency bandwidth, but also reduces the size and increases output power for Samsung’s next generation solutions, including 5G Compact Macro.
“This newly unveiled chipset is the fundamental component of our state-of-art 5G solutions, developed through a long-standing R&D effort that enables Samsung to be at the forefront of delivering cutting-edge 5G technologies,” said Junehee Lee, Executive Vice President and Head of R&D, Networks Business at Samsung Electronics. “As one of the largest semiconductor companies in the world, we are committed to developing the most innovative chips for the next phase of 5G advancement, integrated with the features mobile operators seek to stay competitive.”
“5G chipsets are critical to achieving the performance capabilities required for next-generation network deployments,” stated Anshel Sag, Moor Insights & Strategy. “Samsung’s long-standing expertise in developing chipsets in-house is a key differentiator, positioning it as a leader in the delivery of 5G network solutions with the features and benefits operators seek to advance their 5G strategies.”